TAIFLEX
Copper Clad PI Flex Laminates, Coverlays and Bonding sheets
Taiflex is a Taiwanese company with production facilities in Taiwan and China.
They are focused on the production of flexible materials based on polyimide.
The products are thin and flexible laminates with single and double side copper clad.
These laminates are available with a bonding layer of epoxy between copper and polyimide, but also adhesiveless for enhanced thermal properties.
Supplementary there are several polyimide coverlays available, also with epoxy adhesive.
Finally also pure epoxy based bond plies are available.
All products are halogen free and can be processed with lead free soldering.
Product overview
| Product | Description | Copper | Dielectric | Adhesive | Notes |
|---|---|---|---|---|---|
| THK… | 1s, 2s laminate (IPC 4204/2) | ED RA | Polyimide | Epoxy | halogen-free |
| 2LP… 2FP… 2UP… | 1s laminate 2s laminate (IPC 4204/11) | ED RA | Polyimide | – | halogen-free no adhesive |
| FHK… FHW… FHB… | Coverlay (IPC 4203/2) | – | Polyimide | Epoxy | yellow, halogen-free white, halogen-free black, halogen-free |
| BB… BT… BH… | Bond Ply (IPC 4203/19) | – | – | Epoxy | longer shelf life high Tg, Std. lam. for quick lam. |
| MHK… | Composite film | – | Polyimide | Epoxy | halogen-free |
| RHK… | Stiffener | – | Polyimide | Epoxy | halogen-free |
Product details
Flexible polyimide laminate with epoxy adhesive
| Single side copper (1s) | Double side copper (2s) | |
 |  |
|
| T | Product name | |
| H | Halogen-free | |
| K | PI-film thickness (K: Kapton) | |
| S | S: single side – D: double side (copper clad) | |
| 10 | PI-film thickness: 05: 12 µm – 10: 25 µm – 20: 50 µm | |
| 05 | Cu-foil thickness: 03: 12 µm – 05: 18 µm – 10: 35 µm – 20: 70 µm | |
| 20 | Epoxy adhesive thickness: 13 µm – 20 µm – 50 µm | |
| ME | Type of copper: ME/WP/WD/MW/JE: ED-copper – JY/JA/JC/JD: RA-copper | |
| 0 | Roll width: 0: 500 mm – 1: 250 mm | |
Flexible polyimide laminate adhesiveless
| Single side copper (1s) | Double side copper (2s) | |
 |  |
|
| 2LP: copper foil coated with polyimide resin and thermally cured | 2FP/2UP: copper foil laminated with thermoplastic polyimide (TPI) | |
| 2LP | Product name: 2LP – 2FP – 2UP | |
| S | S: single side – D: double side (copper clad) | |
| E | Cu-foil type: ED copper – RA copper | |
| 10 | PI-film thickness: 05: 12 µm – 10: 25 µm – 20: 50 µm | |
| 10 | Cu-foil thickness: 03: 12 µm – 05: 18 µm – 10: 35 µm | |
| ME | Type of copper: ME/WP/WD/MW/JE: ED-copper – JY/JA/JC/JD: RA-copper | |
| 0 | Roll width: 0: 500 mm – 1: 250 mm | |
Polyimide coverlay with epoxy adhesive
 |  |  |
|
| FHK-yellow | FHB-black | FHW-white (seperate ink layer) | |
| F | Product name | ||
| H | Halogen-free | ||
| K | K: yellow (Kapton) – B: black (PI) – W: white | ||
| 05 | PI-film thickness: 05: 12 µm – 10: 25 µm – 20: 50 µm | ||
| 20 | Epoxy adhesive (B-stage) thickness: 15: 15 µm – 25: 25 µm – 35: 35 µm | ||
Bond Ply made of epoxy resin
 | ||
| B | Product name | |
| B | B: longer shelf life – T: high Tg standard press – H: Quicklam | |
| 15 | Epoxy resin (B-stage) thickness: 15: 15 µm – 25: 25 µm – 35: 35 µm | |
Product downloads
Do you have any questions regarding our base materials?
MSC Polymer AG
Am Boden 27
D-35460 Staufenberg-Mainzlar
Tel: +49 (0) 6406-9149-0
Fax: +49 (0) 6406-6782
E-mail: info@msc-polymer.de