Rigid base materials FR4, CEM1, CEM3 (formerly Huazheng New Material)

Product details

Thickness 1.00 – 4.00 mm unclad and with copper cladding
Copper thickness: 18 – 105 µm.

FR4 with high CTI (> 600 V) available.

CEM1 (copper clad)

Among other things, the CEM1 variety enables the safe production of plated-through circuits in hot air technology as well as production with silver solder paste. The single-sided CCL varieties offer the advantage of a bright white laminate coloring, which means the legend prints for the surfaces remain highly visible even after soldering. Available in 0.8 – 2.0 mm thicknesses with single sided or double sided copper clad of 18 – 105 µm.

CEM1 (High CTI)

The CEM1 High CTI (> 600 V) is suitable for lead-free application processes.

Stock standard: 1.55 mm with copper clad 35/00 and 70/00
Delivery format: 920 x 1270 mm; 1070 x 1160 mm; 1070 x 1270 mm and cut to size


Technical datasheets for all products on request.

Do you have any questions regarding our base materials?

MSC Polymer AG
Am Boden 27
D-35460 Staufenberg-Mainzlar

Tel: +49 (0) 6406-9149-0
Fax: +49 (0) 6406-6782
E-mail: info@msc-polymer.de