Rigid base materials FR4, CEM1, CEM3 (formerly Huazheng New Material)
Thickness 1.00 – 4.00 mm unclad and with copper cladding
Copper thickness: 18 – 105 µm.
FR4 with high CTI (> 600 V) available.
CEM1 (copper clad)
Among other things, the CEM1 variety enables the safe production of plated-through circuits in hot air technology as well as production with silver solder paste. The single-sided CCL varieties offer the advantage of a bright white laminate coloring, which means the legend prints for the surfaces remain highly visible even after soldering. Available in 0.8 – 2.0 mm thicknesses with single sided or double sided copper clad of 18 – 105 µm.
CEM1 (High CTI)
The CEM1 High CTI (> 600 V) is suitable for lead-free application processes.
Stock standard: 1.55 mm with copper clad 35/00 and 70/00
Delivery format: 920 x 1270 mm; 1070 x 1160 mm; 1070 x 1270 mm and cut to size
Technical datasheets for all products on request.