ACF2 / ACF3 Copper foil with Aluminum carrier

The product ACF2™ consists of one piece of copper foil and one panel of aluminum. The loose copper sheet is attached to the aluminum carrier with an inert adhesive. The adhesive is designed to release at 60 °C. The product ACF3™ consists of two pieces of copper foil and one panel of aluminum. Both copper sheets are attached to the aluminum carrier with the same inert adhesive. The inert adhesive becomes weaker with heat. After the lamination cycle aluminum separators are easily broken down.

Product is available with different copper foil types from Circuit Foil:

• HTE (IPC grade 3) for standard FR4 boards Foil type TW-YE
• High bond strength copper for BT and Polyimide Foil type TWS; TWLS
• Very low profile copper for high speed low loss applications Foil type BF-TZA

ACF2™ is designed as a carrier sheet for the top or bottom copper layer in a multilayer printed circuit board. ACF3™ can be used as the top and bottom layers on a multiple multilayer stackup. See following drawing for explanation.

The typical values are based on data from production and from sample measurements in the lab. This data should be considered as general information. It is the responsibility of the user to ensure that the product complies with his requirements.